Participation in first trade-fair for light-weight design

Together with the Saxon Industry and Technology Fair SIT from 23 to 25 June 2010 the LIMA show will take place in Chemnitz. KIESELSTEIN will participate in this trade fair for light-weight materials and technologies which is unique in Germany.

 

At booth H10 we present our vast range of machines and plants for wire production as well as the innovative draw-peeling technology with which we are leading in the world market. Highlight of our presentation our latest development, the product strucwire^®. It is a new 3-dimensional wire structure in light-weight design, that can be used in machine and plant engineering, in automotive industry as well as in medical technology. strucwire^® combines lightness with a stable cellular structure. It is a product that can be adapted to a large variety of application purposes.

 

During the LIMA-symposium Managing Director and company’s founder Dr.-Ing. Stephan Kieselstein will explain the characteristics of strucwire^® and the various fields of application in detail.

 

With the participation in the LIMA show we hope to get in contact with future users of strucwire^® and to have interesting discussions about possible fields of application.